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Patent Analysis for 3D printing
- 6. 6 LIGHTING TECHNIQUES： SELECTIVE LASER MELTING, SLM
- 7. SLM簡介 7 選 擇 性 雷 射 熔 化 （ Selective Laser Melting ， SLM ） 是利用雷射光熔化 鋪展在金屬底板上 的金屬粉末，重複 鋪展金屬粉末和以 雷射光溶化，逐層 疊加造型，反複以 雷射光熔化和疊層 造型，即可得到最 終成品。
- 8. Selective laser melting (SLM) • Selective laser melting (SLM) is an additive manufacturing process that uses 3D CAD data as a digital information source and energy in the form of a high powered laser beam (usually an ytterbium fiber laser) to create three-dimensional metal parts by fusing fine metallic powders together. • The industry standard term, chosen by the ASTM F42 standards committee, is laser sintering, although this is acknowledged as a misnomer because the process fully melts the metal into a solid homogeneous mass. The process is also sometimes referred to by the trade names DMLS or LaserCusing. A similar process is Electron beam melting(EBM), which, as the name suggests, uses an electron beam as the energy source. 8
- 9. 9 SLM DMLSSLS EOS DTM 3D Systems F&S MCP HEK MTT SLM Solutions
- 12. 重要專利-US5837960 US5837960：Selective Laser Melting Assignee：University of California U.S. DoE. 12 Method and apparatus for forming articles from materials in particulate form in which the materials are melted by a laser beam and deposited at points along a tool path to form an article of the desired shape and dimensions. Preferably the tool path and other parameters of the deposition process are established using computer-aided design and manufacturing techniques. A controller comprised of a digital computer directs movement of a deposition zone along the tool path and provides control signals to adjust apparatus functions, such as the speed at which a deposition head which delivers the laser beam and powder to the deposition zone moves along the tool path.
- 13. US5837960引證分析 13
- 14. SLM技術近期專利公開案 14
- 15. 15 專利資訊的重要性 “專利資訊將會是新競爭戰場上的一顆智慧炸彈。” – 摘自《閣樓上的林布蘭》 USPTO 科技評測室 「71% 的專利文件資 訊未曾在其他地方公 開。」 德國馬克斯普朗克科 學促進協會 「75% 的新技術僅揭 露於專利文件。」 EPO 網站 「專利資訊閒置所造 成的浪費，每年達 200 億美元 …」 JPO 網站 「因初期開發階段專 利研究不足而造成的 浪費，達 470 億美 元。」
- 16. 不同時間點發現專利，結果大不同 16 產品開發基礎研究 應用研究 發現與探索實驗 發明 技術研發 產品概念與設計 試產 量產 設計變更成本高 談判籌碼少 支付權利金 Or 退出市場 回避設計 策略合作 尚未投入大量資金並且 有足夠時間尋求替代技術 合作開發 技術方案尚未確認 有機會創造標準
- 18. 簡報完畢 敬請指教
- 20. 20 Thanks for your attention/time. 如需進一步資訊，歡迎洽詢 新聚能科技顧問 朱新瑞 Tel:+886-2-27298424 raychu@synergytek.com.tw